Technical Committees
Technical Editors
Jason H. Anderson
University of Toronto, Toronto, Canada
Leonid Belostotski
The University of Calgary, Calgary, Canada
Dustin Dunwell
Alphawave IP, Toronto, Canada
Vincent Gaudet
University of Waterloo,Waterloo, Canada
Glenn Gulak
University of Toronto, Toronto, Canada
James W. Haslett
The University of Calgary, Calgary, Canada
Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada
Multi-Media Coordinator and Digest Editor
David Halupka
StarIC, Toronto, Canada
Program Chair
Frank O’Mahony
intel, Hillsboro, OR
Program Vice-Chair
Thomas Burd
Advanced Micro Devices, Santa Clara, CA
ITPC European Regional Chair
Matteo Bassi
Infineon TechnologiesAG, Villach, Austria
ITPC European Regional Vice Chair
Viola Schaffer
Texas Instruments, Freising, Germany
ITPC Far East Regional Chair
Man-Kay Law
University of Macau, Taipa, Macau, China
ITPC Far East Regional Vice Chair
Jaehyouk Choi
KAIST, Daejeon, Korea
ITPC North America Regional Chair
Keith Bowman
Qualcomm, Raleigh, NC
ITPC North America Regional Vice-Chair
Jeff Walling
Virginia Tech, Blacksburg, VA
Analog Subcommittee
Chair: Viola Schaffer
Texas Instruments, Freising, Germany
Ippei Akita
AIST, Tsukuba, Japan
Jens Anders
University of Stuttgart, Stuttgart, Germany
Chinwuba Ezekwe
Robert Bosch, Sunnyvale, Ca
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
Danielle Grifith
Texas Instruments, Dallas, TX
Drew Hall
University of California, San Diego, La Jolla, CA
Chuan-Hung Hsiao
MediaTek, Hsinchu City, Taiwan
Minkyu Je
KAIST, Yuseong-gu, Korea
Qiang Li
University of Electronic Science and Technology of China, Chengdu, China
Giulio Ricotti
STMicroelectronics, Cornaredo, Italy
Caspar van Vroonhoven
Analog Devices, Ismaning, Germany
Jiawei Xu
Fudan University, Shanghai, China
Data Converters Subcommittee
Chair: Jan Westra
Broadcom, Bunnik, The Netherlands
Lucien J. Breems
NXP Semiconductors, Eindhoven, The Netherlands
Vanessa Chen
Carnegie Mellon University, Pittsburgh, PA, TX
Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands
Wan Kim
Samsung Electronics, Hwasung-si, Korea
Ying-Zu Lin
Mediatek, Hsinchu, Taiwan
Nima Maghari
University of Florida, Gainesville, FL
Shahrzad Naraghi
Legato Logic, San Jose, CA
Shanthi Pavan
IIT Madras Dept of Electrical Eng., Chennai, India
Seung-Tak Ryu
KAIST, Daejeon, Korea
Hajime Shibata
Analog Devices, Toronto, Canada
Shiyu Su
University of Waterloo, Los Angeles, CA
Xiyuan Tang
Peking University, Beijing, China
Amy Whitcombe
Intel, Santa Clara, CA
Il-Min Yi
Gwangju Institute of Science and Technology, Gwangju, Korea
Digital Architectures & Systems (DAS) Subcommittee
Chair: Rahul Rao
IBM India, Bangalore, India
Mark A. Anders
Intel, Hillsboro, OR
Shidhartha Das
Advanced Micro Devices, Cambridge, United Kingdom
Jie Gu
Northwestern University, Evanston, IL
Ji-Hoon Kim
Ewha Womans University, Seoul, Korea
Hugh Mair
MediaTek, Austin, TX
Bert Moons
Axelera AI, Leuven, Belgium
Sugako Otani
Renesas Electronics, Tokyo, Japan
Nathaniel Pinckney
Nvidia, Cedar Park, TX
Priyanka Raina
Stanford University, Stanford, CA
Soojung Ryu
SAPEON Korea, Seongnam-si, Korea
Sophia Shao
UC Berkeley, Berkeley, CA
Paul Whatmough
Qualcomm, Boston, MA
Chia-Hsiang Yang
National Taiwan University, Taipei, Taiwan
Jun Zhou
University of Electronic Science and Technology of China, Sichuan, China
Digital Circuits (DCT) Subcommittee
Chair: Huichu Liu
Meta Agile Silicon Team, Menlo Park, CA
Benton Calhoun
University of Virginia, Charlottesville, VA
Sylvain Clerc
STMicroelectronics, Crolles Cedex, France
Eric Jia-Wei Fang
Mediatek, Hsinchu City, Taiwan
Kazuki Fukuoka
Renesas Electronics, Tokyo, Japan
Ping‐Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan
Jun-Seok Park
S.LSI, Samsung Electronics, Hwaseong-si, Korea
Arijit Raychowdhury
Georgia Institute of Technology, Atlanta, GA
Visvesh Sathe
Georgia Institute of Technology, Atlanta, GA
Jae-sun Seo
Cornell Tech, New York, NY
Mahmut Ersin Sinangil
Nvidia, Santa Clara, CA
Yvain Thonnart
CEA-List, Grenoble, France
Carlos Tokunaga
Intel, Hillsboro, OR
Kaushik Vaidyanathan
Google, Santa Clara, CA
Masanao Yamaoka
Hitachi, Tokyo, Japan
Heein Yoon
Ulsan National Institute of Science and Technology, Ulsan, Korea
IMMD Subcommittee
Chair: Rikky Muller
University of California Berkeley, Berkeley, CA
Jun-Chau Chien
University of California Berkeley, Berkeley, CA
Azita Emami
California Institute of Technology (Caltech), Pasadena, CA
Leonardo Gasparini
Fondazione Bruno Kessler, Povo, Italy
Sohmyung Ha
New York University Abu Dhabi, Abu Dhabi, UAE
Mutsumi Hamaguchi
Sharp Corporation, Tenri City, Japan
Taekwang Jang
ETH Zurich, Zurich, Switzerland
Mehdi Kiani
Pennsylvania State University, State College, PA
Hyung-Min Lee
School of Electrical Engineering Korea University, Seoul, Korea
Junghyup Lee
DGIST, Daegu, Korea
Carolina Mora-Lopez
Imec, Leuven, Belgium
Masaki Sakakibara
Sony Semiconductor Solutions Corporation, Kanagawa, Japan
Min-Woong Seo
Samsung Electronics Semiconductor R&D Center (SRDC), Hwaseong-si, Korea
Sanshiro Shishido
Panasonic Holdings Corporation, Osaka, Japan
Mahsa Shoaran
EPFL, Geneva, Switzerland
Andreas Suess
OMNIVISION Technologies, Santa Clara, CA
Kea-Tiong (Samuel) Tang
National Tsing Hua Univ., Hsinchu, Taiwan
Augusto Ximenes
CogniSea, Inc., Seattle, WA
Bo Zhao
Zhejiang University Institute of VLSI Design, Hangzhou, China
Memory Subcommittee
Chair: Meng-Fan Chang
National Tsing Hua University, Hsinchu, Taiwan
Juang-Ying Chueh
Etron Technology, Taipei, Taiwan
Chunmeng Dou
Chinese Academy of Sciences (CAS), Beijing, China
Zheng Guo
Intel, Portland, OR
Thomas Hein
Micron, Munich, Germany
Hua-Ling (Cynthia) Hsu
Western Digital, Fremont, CA
Takashi Ito
Renesas, Tokyo, Japan
Dongkyun Kim
SK hynix, Icheon-si, Korea
Hye-Ran Kim
Samsung Electronics, Anyang, Korea
Saekyu Lee
IBM Research Yorktown Heights, Greenwood Village, CO
Seung-Jae Lee
Samsung Electronics, Hwaseong, Korea
Xueqing Li
Tsinghua University, Beijing, China
Violante Moschiano
Intel, Rome, Italy
Hidehiro Shiga
KIOXIA, Yokohama, Japan
Eric Wang
TSMC, Hsinchu, Taiwan
John Wuu
Advanced Micro Devices, Fort Collins, CO
Jun Yang
Southeast University, Nanjing, China
Power Management Subcommittee
Chair: Bernhard Wicht
University of Hannover, Hannover, Germany
Sally Amin
Apple, Cupertino, CA
Patrik Arno
ST Microelectronics, Grenoble, France
Saurav Bandyopadhyay
Texas Instruments, Dallas, TX
Ke-Horng Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Lin Cheng
University of Science and Technology of China, Anhui, China
Sung-Wan Hong
Sogang University, Seoul, Korea
Mo Huang
University of Macau, Taipa, Macao, China
Rinkle Jain
Nvidia, Santa Clara, CA
Shusuke Kawai
Toshiba, Kawasaki, Japan
Xugang Ke
Zhejiang University, Hangzhou, China
Dongsu Kim
Samsung Electronics Systems, Hwaseong-si, Korea
Hyun-Sik Kim
KAIST, Daejeon, Korea
Hanh-Phuc Le
University of California San Diego, La Jolla, CA
Xun Liu
The Chinese University of Hong Kong, Shenzhen, Hong Kong
Kousuke Miyaji
Shinshu University, Nagano, Japan
John Pigott
NXP Semiconductors, Chandler, AZ
Gael Pillonnet
CEA-Leti, Grenoble, France
Frank Pramassing
Infineon Technologies Austria AG, Villach, Austria
Joseph (Joey) Sankman
Analog Devices, Fort Collins, CO
Xin Zhang
IBM T. J. Watson Research Center, Yorktown Heights, NY
RF Subcommittee
Chair: Brian Ginsburg
Texas Instruments, Dallas, TX
Masoud Babaie
Delft University of Technology, Zuid-Holland, The Netherlands
Sudipto Chakraborty
IBM T. J. Watson Research Center, Plano, TX
Dmytro Cherniak
Infineon Technologies, Villach, Austria
Jaehyouk Choi
Seoul National University, Seoul, Korea
Debabani Choudhury
Intel, Thousand Oaks, CA
Wei Deng
Tsinghua University School of Integrated Circuits, Beijing, China
Jeremy Dunworth
Qualcomm Technologies Inc., San Diego, CA
Xiang Gao
Zhejiang University, Hangzhou, China
Hiroshi Hamada
NTT, Kanagawa, Japan
Ruonan Han
Massachusetts Institute of Technology, Cambridge, MA
Mona Hella
Rensselaer Polytechnic Institute, Troy, NY
Yu-Li Hsueh
Mediatek Inc, Hsinchu, Tiawan
Danilo Manstretta
University of Pavia, Pavia, Italy
Omeed Momeni
University of California Davis, Davis, CA
Mina Shahmohammadi
NXP, Zuid Holland, The Netherlands
Henrik Sjöland
Lund University, Ericsson Research, Lund, Sweden
Jeff Walling
Virginia Tech, Blacksburg, VA
Hongtao Xu
Fudan University, Shanghai, China
Jun Yin
University of Macau, Taipa, Macau, China
Security Subcommittee
Chair: Ingrid Verbauwhede
KU Leuven, Leuven, Belgium
Utsav Banerjee
Indian Institute of Science, Bengaluru, India
Chiraag Juvekar
Apple, San Carlos, CA
Yong Ki Lee
Samsung Electronics, Suwon-si, Korea
Leibo Liu
Tsinghua University, Beijing, China
Sanu Mathew
Intel, Hillsboro, OR
Thomas Poeppelmann
Infineon Technologies, Bavaria, Germany
Shreyas Sen
Purdue University, West Lafayette, IN
Takeshi Sugawara
The University of Electro-Communications Chofugaoka, Tokyo, Japan
Rabia Tugce Yazicigil
Boston University, Boston, Ma
Technology Directions Subcommittee
Chair: Ali Hajimiri
Caltech, Pasadena, CA
Firooz Aflatouni
University of Pennsylvania, Philadelphia, PA
Joseph Bardin
Google & UMass Amherst, Goleta, CA
Denis Daly
Apple, Wellesley, MA
Giorgio Ferrari
Politecnico di Milano, Milano, Italy
Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan
Kyeongha Kwon
KAIST, Daejeon, Korea
Noriyuki Miura
Osaka University, Osaka, Japan
Alyosha Molnar
Cornell University, Ithaca, NY
Daniel H. Morris
Meta, Sunnyvale, CA
Jacques "Chris" Rudell
University of Washington, Seattle, WA
Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands
Kaushik Sengupta
Princeton University, Princeton, NJ
Guy Torfs
Ghent University, Ghent, Belgium
Kaiyuan Yang
Rice University, Houston, TX
Milin Zhang
Tsinghua University, Beijing, China
Wireless Subcommittee
Chair: Chih-Ming Hung
MediaTek, Taipei, Taiwan
Matteo Bassi
Infineon Technologies AG, Villach, Austria
Wu-Hsin Chen
Qualcomm, San Diego, CA
Hao Gao
Southeast University, Nanjing, China
Giuseppe Gramegna
imec, Leuven, Belgium
Jane Gu
University of California Davis, Davis, CA
Kuo-Ken Huang
Everactive, USA
Renzhi Liu
Intel, Hillsboro, OR
Byung-Wook Min
Yonsei University, Seoul, Korea
Jan Prummel
Renesas Design Netherlands B.V. ‘s-Hertogenbosch, The Netherlands
Raja Pullela
Maxlinear, USA
Negar Reiskarimia
Massachusetts Institute of Technology (MIT), Cambridge, MA
Shahriar Shahramian
Nokia – Bell Labs, New Providence, NJ
Ho-Jin Song
Pohang University of Science and Technology (POSTECH), Pohang, Korea
Alberto Valdes-Garcia
IBM Research, Yorktown Heights, NY
Yun Yin
Fudan University, Shanghai, China
Yuanjin Zheng
School of Electrical and Electronic Engineering Nanyang Technological University, Singapore
Alireza Zolfaghari
Broadcom, Irvine, CA
Wireline Subcommittee
Chair: Thomas Toifl
Cisco Systems, Thalwil, Switzerland
Tamer Ali
Mediatek, Irvine, CA
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Zeynep Deniz
IBM, Yorktown Heights, NY
Masum Hossain
Carleton University Department of Electronics, Ottawa, Canada
Kenny Hsieh
TSMC, Hsinchu, Taiwan
Jay Im
AMD, San Jose, CA
Mozhgan Mansuri
Intel, Hillsboro, OR
Didem Turker Melek
Cadence Design Systems, San Jose, CA
Peter Ossieur
Imec, Univ. Ghent, Ghent, Belgium
Ben Rhew
Samsung, Hwaseong-si, Korea